XEM8350 Integration Acceleration

FPGA Development Board with AMD-Xilinx Kintex UltraScale

Lifecycle status: Production Status: Production Product Slide Deck
1 PC
XCKU060, 4-GiB DDR4
add to cart $4,499.95
XCKU060 (-3E), 4-GiB DDR4
add to cart $6,999.95
XCKU115 (-1), 4-GiB DDR4
add to cart $6,999.95
Breakout board (advanced) for the XEM8350
add to cart $399.95
Breakout board (basic) for the XEM8350
add to cart $199.95
12V Power Supply
add to cart $29.95
Active fansink for the XEM8350
add to cart $59.95
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The XEM8350 is a high-performance FPGA development board based on the AMD-Xilinx Kintex UltraScale FPGA. In addition to a high gate-count FPGA, the XEM8350 employs two fully-independent SuperSpeed USB 3.0 interfaces for configuration downloads and data transfer. With integrated DDR4, power supplies, platform flash, high-speed transceivers, Samtec mezzanine connectors, and voltage, current, and temperature monitoring, the XEM8350 is ideal for ultra high-end data acquisition and computation loads.

FrontPanel® SDK

Opal Kelly’s FrontPanel SDK is an easy-to-use, robust API for communication, configuration, and interfacing to your PC, Mac or Linux hardware. FrontPanel handles all the interaction between your software and the FPGA internals, dramatically reducing the time and effort required to interface to a design.

FlashPrototyping and OEM Integration

Opal Kelly FPGA integration modules are designed to be the ideal turnkey solution for prototypes and OEM product integration. With the complete FrontPanel SDK, there’s simply no faster, more reliable, production-ready way to jump start your FPGA design.

Block diagram

Block diagram




28 high-speed gigabit transceivers are available with standard support for 10 GbE, JESD-204B, DisplayPort, PCI Express, HD-SDI, XAUI, Aurora, SATA, and others operating up to 12.5 Gb/s (16.375 Gb/s optional).



Two fully-independent USB 3.0 interfaces supports full-duplex operation.


4 GiB DDR4

Integrated DDR4 has a 72-bit data bus for high bandwidth transfers with ECC.



Integrated device sensors provide real-time measurement of temperature as well as voltage and current of the on-board high-efficiency switching power supplies. Measurements are available via the API.

Customer Deployments

  • Ultra high-end data acquisition
  • Quantum photonics
  • Satellite imagery
  • Radar system - test interface, system integration, field testing
  • University research


  • Image or video capture / processing
  • Data acquisition (including JESD204B)
  • ASIC / hardware-based simulation and verification
  • High-Speed (Gigabit) Serial Interfaces
  • Digital communications / software-defined radio
  • High-speed USB / FPGA co-processor
  • Custom 5G test equipment
  • Cryptography
  • Data Security

Technical Specifications and Support

Features & Specifications

  • Xilinx Kintex UltraScale XCKU060-1FFVA
    (for XCKU115-1FLVA, please contact [email protected])
  • 2x 16-MiB serial flash (Cypress S25FS128SAGBHI200 or equivalent)
  • 32-MiB dedicated serial flash for FPGA boot via QSPI (ISSI IS25WP256D or equivalent)
  • 4-GiB DDR4 (5x Micron MT40A512M16LY or equivalent)
  • Small form-factor -- 145mm x 85mm x 17.1mm (5.71" x 3.35" x 0.67")
  • Dual SuperSpeed USB 3.0 interface (Cypress FX3) for configuration and data transfer
  • Measured performance over 600 MiB/s
  • Self-powered by external DC source
  • Low-jitter programmable clock oscillator (Si5338B)
  • Eight LEDs
  • Three Samtec board-to-board connectors (2x QSH-090 and QSH-060)
  • 332 user I/O including GC pairs
  • 28 Gigabit Transceivers (7 quads) and 4 reference clock pairs
  • Independent access to VCCO bank voltages
  • On-board device sensors for real-time voltage, current, and temperature monitoring
  • JTAG pins available on the expansion connectors
  • Full FrontPanel virtual control panel support
  • SYZYGY SmartVIO controller
  • Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java